Technology Trends

Advanced Packaging Landscape

SiP is a more flexible, cost ­effective solution for system integration in many cases, particularly when heterogeneous technologies as involved. Read more…

A Holistic Approach to Lead-Free Transition

This paper will review the key compatibility issues involved, and the strategy for the transition to lead-free. Read more…

Assembly Capability for Miniaturization

This paper will review the key issues involved for complete assembly capability for miniaturization, including components, PCB design, stencil technology and aperture design, solder paste evaluation and printing process, component placement and equipment capability, reflow, AOI, rework, and reliability, for both Sn-Pb and lead-free solders. Read more…

Industry Outlook

The transition to environmental compliance will have a significant impact on the business landscape in the electronics industry. RoHS compliance capabilities, DFE capabilities and recycling for product end-of-life management will become key competitive differentiators for firms in the industry. At the same time, the industry will continue to pursue miniaturization, time to market, and cost reduction initiatives, to support the growth and penetration of the electronics market. Read more…

Board Assembly Trends & Priorities

The latest drivers are conversion cost reduction, NPI time reduction, greater I/O density, and environmental compliance. Read more…

Design for Manufacturing in Global Outsourcing Environment

Harmonized DFX across the industry will help accelerate product development and improve manufacturing quality, and ultimately help the entire industry become more competitive. Read more…

Development of Thermal Interface Materials

The driving forces, fundamental ideas, experimental results, as well as theoretical modeling work are discussed. Read more…

Electronics Packaging & Board Assembly Technology Trend Read more…

Electronics Product Miniaturization Read more…

Environmental Leadership in Electronics Manufacturing Read more…

Global Trends in Electronics Manufacturing Read more…

Global Trends in Packaging & Assembly Technology Read more…

Board Assembly Roadmap Read more…

Roadmap: Printing & Dispense Read more…

Lean & Six Sigma Read more…

Managing Global Capabilities to Meet Emerging Industry Challenges Read more…

Assembly Technology Trends & Impact on Supply Chain Read more…

Strategy for Environmental Leadership in Electronics Read more…

Technology Roadmapping Read more…