Semiconductor Packaging & System in Package (SiP)
2.5D TSV Assembly Read more…
Effect of Thermal Annealing on TSV Cu Protrusion and Local Stress Read more…
Parasitic Parameter Extraction and Modeling of Via of High Speed Differential Pair Read more…
Process Development for 3D Integration Read more…
Wafer Level Warpage Characterization for Backside Manufacturing Processes of TSV Interposers Read more…
Analysis on Electromagnetic Isolation Issues Among Multi-chips in System in Package Read more…
Circuit Modeling and Structure Optimization of Integrated Passive Inductors Read more…
Design and Implementation of a 700-2600MHz RF SiP for Micro Base Station Read more…
Modeling, Simulation and Analysis of Coplanar Waveguide on Glass Substrate for 2.5D Integration Read more…
Novel Band-pass Filters on Thin Glass Substrate with Through Glass Vias (TGVs) Read more…
Design Optimization for a Band Pass-Filter with IPD Technology for RF Front-end Application Read more…
Alternative Assembly Methods for Lead-Free Solder Flip Chips on FR-4 Substrates Read more…
Assembly Processes for Flip Chips on Substrates Read more…
3D Packaging and System Integration Read more…
Design & Process Development for 2.5D TSV Interposer Read more…
Reliability Evaluation of Wire Bonds & Lead Free Solder Joints Read more…
Performance Evaluation of Chip on Board Wire Bonds Read more…
Flip Chip Assembly on PCB Read more…
Investigation of Solder Ball Attachment Processes Read more…
Lead-Free Solder Flip Chips on FR-4 Substrates Read more…
Lead-Free Solder Flip Chips with Different Surface Finishes, Underfills and Fluxes Read more…
PoP Process Development and Reliability Evaluation Read more…
Package Stacking in SMT for 3D PCB Assembly Read more…
Process Development & Reliability Evaluation of Inline PoP Assembly Read more…
Reliability of WLP-QFN Modules Read more…
Assembly Processes for Solder Flip Chips Read more…