Patents
Soldering Process with Minimal Thermal Impact on Substrate Read more…
A Solder Composition Read more…
Aluminum Components Coated with Zn-Sb Alloy for Manufacturing Assembly by CAB Brazing Read more…
Camera Module with Premolded Lens Housing & Method of Manufacture Read more…
Conductor System for Thick Film Electronic Circuits Read more…
Connection of Multilayer Printed Conductive Ink Through Filled Microvias Read more…
Electrical Solder & Method of Manufacturing Read more…
Flip Chip Interconnection on Electronic Modules Read more…
Integrated Lens & Chip Assembly for a Digital Camera Read more…
Lead-Free Electrical Solder & Method of Manufacturing Read more…
Lead-Free Solder Alloys Read more…
Lead-Free Solder Composition Read more…
Lead-Free Solder Composition Read more…
Lead-Free Solder Compositions Read more…
Lead-Free Low Temperature Solder Compositions Read more…
Low Temperature Lead-Free Solder Compositions Read more…
Low Temperature Solder Compositions Read more…
Metallic Adhesive for Forming Electronic Interconnects at Low Temperatures Read more…
Method of Forming Interconnections on Electronic Modules Read more…
Method of Forming Interconnections on Electronic Modules Read more…
Method of Manufacturing Fan Out Wafer Level Package Read more…
Lead-Free Electrical Solder & Method of Manufacturing Read more…
Solder Composition & Method for Making the Same Read more…
Solder Composition & A Method for Making the Same Read more…
External Adjustment Mechanism for a Camera Lens & Electronic Imager Read more…
Wafer Based Camera Module & Method of Manufacture Read more…
Stress Relief Encapsulation for Flexible Hybrid Electronics Read more…
Electronics Encapsulation Through Hotmelt Lamination Read more…
System in Package with Double Side Mounted Board Read more…
Wafer Level Camera Module with Molded Housing and Method of Manufacturing Read more…
Embedded Copper Structure for Microelectronics Package Read more…