Soldering & Electronic Materials ——
PCB, Solders, Underfills, Adhesives, Encapsulants, TIM, …
Metallurgy, Processing & Reliability of Lead-Free Solder Joint Interconnections (Book chapter) Read more…
Microstructural Evolution of Sn-Ag Based Lead-Free Solders (Book chapter) Read more…
Effect of No-Clean Flux Residue on Signal Integrity at High Frequency Read more…
Investigation of Solder/Flux Residue Effect on RF Signal Integrity Read more…
Process Evaluation of Sn/Zn/Bi Solder Paste Read more…
Aging of PCB Surface Finishes in Lead-Free Solder Applications Read more…
Intermetallic Layer Thickness during Solder Joint Formation Read more…
Cu Dissolution in Lead-Free Solders Read more…
Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions Read more…
Evaluation of Immersion Silver Surface Finish for Automotive Electronics Read more…
Evaluation of Lead-Free Solder Paste Read more…
Evaluation of OSP Surface Finishes for Lead-Free Soldering Read more…
Evolution of Intermetallic Compounds in PBGA Sn-Ag-Cu Solder Joints during Thermal Cycling Read more…
High Temperature Aging Study of Intermetallic Compound Formation of Sn-Ag-Cu Solders Read more…
Impact Performance of Microvia and Buildup Layer Materials Read more…
Intermetallic Compound Formation in Lead-Free Solder Joints in Reflow Soldering Read more…
Lead-Free Solder Alloys Read more…
Measurement of Thermal Conductivity & Specific Heat of Lead Free Solder Read more…
Metallurgical Analysis & Hot Storage Testing of Lead-Free Solder Interconnects Read more…
Metallurgy & Kinetics of Liquid–Solid Interfacial Reaction during Lead-Free Soldering Read more…
Microstructure Changes in Sn-Ag Solder Alloy during Creep Read more…
Microstructural Evolution of Sn-Ag Solder Joints Resulting from Cu Dissolution Read more…
Microstructural Investigation of Lead-Free Solder Joints Read more…
Microstructural Investigation of Sn-Ag Solder Joints Read more…
Overview of Lead Free SAC Alloys Evaluation & Reliability Read more…
PCB Pad Cratering Evaluation Read more…
Performance Evaluation of Lead-Free Solders Read more…
Process Development & Reliability Evaluation of Conductive Adhesives Read more…
Process Development & Solder Joint Reliability of Lead-Free Solders Read more…
Selecting Lead-Free Solder Paste Materials Read more…
Microstructures and Creep Resistance of Sn-Ag-Cu Lead-Free Solder Read more…
Immersion Silver & Tin PCB Surface Finishes for Lead-Free Soldering Read more…
Immersion Silver & Tin PCB Surface Finishes for Lead-Free Solder Applications Read more…
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder Read more…
Wetting of Immersion Sn and Ag Surface Finishes by Lead-Free Solder Read more…
Development of High Adhesion Nano-Thermal Interface Materials Read more…
Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material Read more…
Structure and Morphology of Thermal Interface Material (Nano TIM) Read more…
Manufacturing & Characterization of Nano Silver Particles Based Thermal Interface Material Read more…
Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications Read more…
New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Read more…
New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging Read more…
Polymer-Metal Nano-Composite Films for Thermal Management Read more…
Process Development & Reliability of ACF Bonding with Multiple PCB Surface Finishes Read more…
Innovative Materials for Advanced Semiconductor Packaging Read more…
A New Method of Measuring the Fitness for Use of Conformal Coatings Read more…
Application of Dielectric Spectroscopy (DS) For Quality Control of Solvent-Borne Conformal Coatings Read more…