Reliability
Book “Lead-Free Solder Interconnect Reliability” Read more…
FCBGA Reliability Read more…
Drop Test Performance of Fine Pitch BGA Assemblies Using Lead-free and Tin-lead Solders Read more…
Drop Test Vehicle for a Uniform Shock Response Read more…
Method to Evaluate BGA Pad Cratering in Lead-Free Soldering Read more…
Thermo-Mechanical Reliability of Lead-free PTH Solder Joints Read more…
Study of Lead-Free Solder Joints Read more…
Thermal Fatigue Life of PBGA Lead-Free Solder Joints Read more…
Multi-Axial Sub-Micron Fatigue Tester with Applications to Electronic Packaging Materials Read more…
Analysis of Crack Growth in Solder Joints Read more…
Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop Read more…
Mechanical Performance of Sn/Ag/Cu Solder Joints Read more…
Reliability of Sn-8Zn-3Bi Lead-Free Solder Joints Read more…
Coffin-Manson Equation Determination for Sn-Zn Based Lead-Free Solder Joints Read more…
Deformation and Fatigue Fracture of Solder Alloys under Complex Loading Conditions Read more…
Deformation Behaviors of Solder Alloys under Variable Strain Rate Shearing & Creep Conditions Read more…
Design for Lead-Free Solder Joint Reliability of High Density Packages Read more…
Lead-Free Solder Joint Reliability of High-Density Packages Read more…
Design for Reliability with a New Modeling Methodology for Chip to Package Interactions Read more…
Design, Materials and Processes for Lead-Free Assembly of High Density Packages Read more…
Drop Impact Reliability of Lead-Free Chip Scale Packages Read more…
Drop Test Reliability of Lead-free Chip Scale Packages Read more…
Effect of IMC Growth on Thermal Cycling Reliability of Micro Solder Bumps Read more…
Mechanical Strength of Pb-Free and Sn-Pb Solder Alloys Read more…
Effects of BGA Rework Cycles on PCB Assembly Reliability Read more…
Effects of Load and Thermal Conditions on Lead-Free Solder Joint Reliability Read more…
Effects of Multiple BGA Rework on Strength of Solder Joints Read more…
Intermetallic Growth & Mechanical Strength of Pb-free and Sn-Pb BGA Solder Balls Read more…
Failure Analysis of Lead-Free Solder Joints for High Density Packages Read more…
Failure Analysis of Lead-Free Solder Joints of CCGA Packages Read more…
Failure Analysis Techniques for Lead Free Solder Joints Read more…
Failure Mechanism and Testing of PCB Pad Cratering Read more…
Fracture of Sn-Ag Solder Alloys under Creep Read more…
Pin Through-Hole Solder Joint Reliability Read more…
Reliability of Microvias and Buildup Layer Materials Read more…
Nucleation & Growth of Tin Whiskers Read more…
Indentation Induced Tin Whisker Formation Read more…
Deformation & Fatigue of Solder Alloys Under Complex Load Conditions Read more…
Investigation of Lead-Free Solder Alloys Read more…
Investigation of Electronics Packaging Materials Read more…
The Effect of Solder Flux Residues on RF Signal Integrity Read more…
Fatigue Tests of PBGA SnAgCu Lead-Free Solder Joints Read more…
Lead-Free Design, Materials and Process of High Density Packages Read more…
Lead-Free Solder Interconnect Reliability Read more…
Lead-Free Solder Joint Reliability Read more…
Life Prediction of Lead-Free Solder Joints Read more…
Mechanical Properties of Lead-Free Solder Alloys Measured by Nano-Indentation Read more…
Nano-Indentation Study on Whisker Formation Read more…
Stress Induced Tin Whisker Formation Read more…
Pad Cratering Evaluation of PCB Read more…
Performance of Lead-Free Solder Joints Under Dynamic Mechanical Loading Read more…
Performance of QFP Lead-Free Solder Joints Under Dynamic Mechanical Loading Read more…
Reliability of Lead Free Solder Joints with Different Surface Finishes & Reflow Profiles Read more…
Reliability of Mixed Alloy Solder Joints Read more…
Reliability of SAC Solder Joints Read more…
Reliability of Lead-Free Area Array Packages with Tin-Lead Soldering Processes Read more…
Reliability of Solder Joints for 0201 Components Read more…
Reliability of CCGA Packages with Lead-Free Solder Read more…
Reliability Testing & Data Analysis of Lead-Free Solder Joints for High-Density Packages Read more…
Reliability of Lead-Free Area Array Packages under Various Sn-Pb Soldering Process Conditions Read more…
Strain Gage Testing for PCB Assembly & Test Read more…
Thermal Fatigue Life Prediction for PBGA Lead-Free SAC Solder Joints Read more…
Thermal Fatigue Life Prediction for PBGA Lead-Free Solder Joints Read more…
Thermal Management of 3D PoP on Ceramic Substrates Read more…
Themo-mechanical Properties of Lead-Free Solder Alloys Read more…
Thermal Mechanical Property Testing of Lead-Free Solder Joints Read more…
Thermal Fatigue Life Prediction for WLCSP Lead-Free Solder Joints Read more…
Thermal Fatigue Life Prediction for Lead-Free Solder Joints Read more…
Tin Whisker Formation Kinetics Read more…
Tin Whisker Nucleation & Growth Read more…